Category/Topic
Research
Level
Federal
Summary

The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.

Eligible Entities
Academic Institutions, Private Corporations
Eligibility Notes

All responsible sources capable of satisfying the Government’s needs may submit a proposal that
shall be considered by DARPA. Historically Black Colleges and Universities, Small Businesses, Small Disadvantaged Businesses and Minority Institutions are encouraged to submit proposals and join others in submitting proposals; however, no portion of this announcement will be set aside for these organizations’ participation due to the impracticality of reserving discrete or severable areas of this research for exclusive competition among these entities.

Due Date
Apr 11, 2023
RFP Release Date
Jan 23, 2023
Max Award
$69,000,000
Match Required?
No
Funder
Department of Defense Microsystems Technology Office
Total Amount Available for All Grants
$69,000,000
Resources
Opportunity Posting or Webpage

Solicitation
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